Finwave: Revolutionary 5G Hardware

Powering the next generation of the internet

5G Smart City Network Overlay
Published on


3 min

If there’s one constant in the world of connected technology, it’s that change is inevitable. Hardware and software protocols are drafted and retired; manufacturers strive to keep pace with demand from retail consumers, corporations, and governments; and the envelope for speed and reliability is constantly pushed. Today’s leading-edge devices can become little more than a paperweight in five years’ time.

The adoption of the 5G wireless standard by leading phone and device manufacturers has resulted in a leap forward in speed and connectivity. But this generational shift has also driven the need for new types of chips capable of delivering 5G speeds more efficiently and with lower latencies. What seems like an impossible engineering task has been taken up by Alumni Ventures portfolio company Finwave, which specializes in producing gallium nitride (GaN) semiconductors to power the next iteration of the internet.

Unrivaled Power and Efficiency

Many consumers might see 5G as little more than an additional bullet point among the features of their newest smartphone. The reality is that 5G represents a significant shift in how data is sent and received. 5G offers faster data rates, more bandwidth, and significantly lower latency than 4G.

However, the benefits of 5G can be lost on devices with sub-standard hardware. Even the latest 5G devices can suffer from subpar radio output power and power efficiency due to their reliance on legacy chip manufacturing processes. This is where Finwave’s 3DGaN technology shines. It allows the production of chips that offer higher output power and increased efficiency, while still being made in traditional chip fabrication plants.

What We Like About Finwave

Impressive IP Portfolio: The company possesses a well-developed intellectual portfolio built over a decade, with 25 issued patents to date.

Growing Market: Disruptive GaN semiconductor technology is poised for multi-year growth as existing silicon chips are replaced in the global high-power RF amplifier market. This sector is projected to reach a $14.7 billion valuation by 2031.

Efficient Business Model: Finwave’s capital-light “fabless” model employs third-party chip production and packaging partners. This is a model already validated by similar companies such as Navitas ($1.7 billion IPO in December 2021).

Long-Term Product Potential: The tech has long-term appeal across a variety of growing verticals including 5G, 6G, renewable energy, EVs, and data centers.

How We Are Involved

Castor Ventures (for the MIT community) sponsored Alumni Ventures’ investment in Finwave’s $12.2 million Series A led by Fine Structure Ventures. Sibling fund Strawberry Creek Ventures (for the Berkley community) also participated in the round, alongside AV’s Total Access Fund and Deep Tech Fund.

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Contact [email protected] for additional information. To see additional risk factors and investment considerations, visit